Ngokusho kwe-tipster ku-X, iHuawei isivele ithuthukisa isizukulwane sayo esilandelayo se-Taishan cores enamandla kakhulu futhi eyonga amandla kunangaphambili. Ama-Taishan cores kuthiwa azosetshenziswa ekwakhiweni kwe-CPU ezayo yeHuawei. Azosebenza njengama-cores awonga amandla futhi azoba nokusetshenziswa kwamandla okuphansi.
I-tipster ithi ama-cores amasha eHuawei Taishan azodlula iKirin 9000S' Cortex-A510 cores. Ngakho-ke ngenkathi zizosebenza kahle kakhulu, zizoletha iqhubu elibalulekile lokusebenza. Isakhiwo esizayo se-Taishan V130 sizohlose ukuncintisana ne-Apple's M3 chip futhi izosekelwe endaweni yokukhiqiza engu-5nm. Uma lokho kunembile, kuzoba nokuthuthuka okukhulu kwenkampani. Ngemuva kwakho konke, uHuawei ubekwe engcupheni enkulu unswinyo lwaseMelika. Naphezu kokuvinjelwa okunciphise kakhulu ukufinyelela kwenkampani kwezobuchwepheshe, ikwazile ukunqoba izingqinamba zayo futhi yabuyela esikhundleni esifanele emakethe.
Asazi okwamanje uma ama-cores asezigabeni ezithuthukisiwe zokuthuthuka ukuze alungele amafulegi alandelayo we-Huawei. Imininingwane nayo iyindlala kuma-Taishan cores amasha. Okwamanje, sigaya ulwazi olusha ngosawoti omncane, kuyilapho sisalinde imininingwane esemthethweni ngqo evela ku-Huawei.
UBUYA KA-HUAWEI EMAKETHINI YECHIPSET
Kuyathakazelisa ukuthi ukuthuthukiswa okuqhubekayo kwama-Taishan cores kuqinisekisa ukubuya kukaHuawei embonini yama-chip. Ngemuva kwekhefu ngenxa yezinhlawulo zase-US, uHuawei wethule kabusha ama-chips e-Kirin ngomugqa we-Mate 60. Umnyakazo wamaqhinga uveze imiphumela emihle. Uphiko lwe-HiSilicon luthumele ama-chips angaphezu kwezigidi ezingu-8 enza imali eyizigidi eziyizinkulungwane ezingu-6 zamaRandi ku-Q1 2024. Kuyaphawuleka ukuthi ukwethulwa kwe-smartphone ye-Huawei Pura 70 efakwe i-Kirin silicon kwaphushela izinombolo phambili.
Akunakuphikwa ukuthi ama-chips e-HiSilicon asabambezeleka uma eqhathaniswa neQualcomm, MediaTek, Samsung, ne-Apple. Lezi zinkampani ziyakwazi ukufinyelela kuma-founder asezingeni eliphezulu kakhulu. Ngenkathi i-Apple, i-Qualcomm, i-MediaTek, ne-Samsung sebezongena enkathini ye-3nm, i-Huawei ihambisa ama-chips angu-5nm. Ngaphandle kwalokhu mkhawulo wezobuchwepheshe, ama-chipset ahloniphekile futhi ajabulela ukwamukelwa kwemakethe okuqinile.
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