- Imephu yendlela ye-CPIA yeshishini lelanga laseTshayina libona ukukhula okubonakalayo kwemveliso kulo lonke ikhonkco lemizi-mveliso
- Ilizwe liya kwandisa imveliso yepolysilicon, iiwafers, iiseli kunye neemodyuli malunga ne-50% kulo nyaka
- Ishishini liqeshe abantu abazizigidi ezi-3.53 ngo-2022, kwaye amanani aya kukhula aye phakathi kwe-4.875 yezigidi kunye ne-5.808 yezigidi ngo-2025.
Abavelisi bemodyuli yelanga yaseTshayina balungiselela ukuhambisa ngaphezulu kwe-750 GW yeemodyuli ngo-2024, emele ukukhula okungaphezulu kwama-50% ngonyaka ngaphezulu kwe-499 GW abayizise ngo-2023, ngokutsho kweChina Photovoltaic Industry Association (CPIA).
Kulo nyaka ikwaza kubona ishishini lemveliso yelizwe livelisa i-820 GW ye iiseli zelanga, ukusuka kwi-545 GW ngo-2023. Ukukhutshwa kwe-Silicon wafer kulindeleke ukuba kudlule i-935 GW kulo nyaka ngokuqwalasela izicwangciso zokwandisa iinkampani ezihamba phambili kwindawo. Kunyaka ophelileyo, ilizwe lisondele kwi-622 GW, liye lenyuka nge-67.5% YoY (bona iChina iSolar PV Output ngo-2023 igqithise kwi-RMB 1.7 yetriliyoni).
Emva kokuhambisa i-1.43 yezigidi zeetoni ze polysilicon kunyaka ophelileyo kunye ne-67% yokunyuka konyaka, i-China ijonge kwiitoni ze-2.1 yezigidi kulo nyaka, ngokutsho kwe-CPIA eyenza le nkcazo kwi-China Photovoltaic Industry Development Roadmap (2023-2024) esanda kukhutshwa.
Ingxelo ye-CPIA ichukumisa izalathisi ezingundoqo ezingama-77 kulo lonke ikhonkco lexabiso lePV lelanga elibonisa ubume bophuhliso kunye nentsingiselo yoshishino, iteknoloji kunye nemarike. Le ngxelo ikwaxela kwangaphambili iindlela zophuhliso kule minyaka imbalwa izayo ukuya kutsho ngo-2030, kudityaniswe nenkqubo yendaleko yetekhnoloji kunye nemeko yangoku yoshishino.
Ngo-2024, umbutho ubikezela i-China ukuba ifake ukuya kwi-220 GW AC izongezo ze-PV entsha kunye nemiqobo yomhlaba kunye nomthamo wegridi njengeengxaki ezinkulu, emva kokukhula ukuya kwi-216.30 GW AC ngo-2023 (bona iShishini lilindele ukuFakelo lweSolar yaseTshayina iSpree ukuba ithothe).
Ukuxhasa lo mthamo ukhulayo wePV welanga, njengoqoqosho olukhulu lwehlabathi lwase-US, iYurophu, iJapan kunye noMzantsi Korea, iChina nayo iyalikhuthaza ishishini lokugcina amandla. I-China ifake kufutshane ne-22.6 GW yamandla amatsha okugcina amandla asekhaya kunye nexesha eliqhelekileyo lokugcina iiyure ezi-2.1.
Njengoko inkxaso yolawulo yokugcina ikhula ngokuhambelana nokuphuculwa kwetekhnoloji ehlisa iindleko zayo, i-China inokugqithisa umthamo we-31 GW kobu buchwepheshe ngo-2025.
Ngokutsho kombutho, iindleko zotyalo-mali zangoku zokusebenzisa i-10,000-toni ye-trichlorosilane umgca wokuvelisa i-polysilicon yi-RMB 90 yezigidi / iitoni eziliwaka. Ukulindela ukuphuculwa kwezobuchwepheshe, utyalo-mali / iitoni eziliwaka ziya kuhla kwi-RMB 80 yezigidi nge-2030.
Naxa ifika ubukhulu be-silicon, obhityileyo ngcono. Ubukhulu obuqhelekileyo be-polysilicon wafers ngo-2023 yayiyi-170 μm. Nangona i-CPIA ingaboni naluphi na utshintsho kweli xabiso kulo nyaka, ikholelwa ukuba ingatshintsha kwiminyaka elandelayo.
"Ukugcina ukukhuphisana kweemveliso zohlobo lwe-n, i-TOPCon n-uhlobo lwe-silicon wafer iimveliso kwiiseli zelanga kunye neeseli ze-heterojunction (HJT) zinempembelelo enamandla yokunciphisa ubukhulu. Ubukhulu obuqhelekileyo be-n-type wafers ye-silicon esetyenziswe kwiiseli ze-TOPCon yi-125 μm, kwaye ubukhulu be-silicon wafers esetyenziswa kwiiseli ze-heterojunction malunga ne-120μm, oku kukuncipha kwe-15μm kunye ne-5μm ngokulandelelanayo xa kuthelekiswa ne-2022, "ifundeka ingxelo.
Ukucinga ngeentlobo ezahlukeneyo iisayizi zewafer kwimarike namhlanje, isabelo 182 mm square wafers yi 47.7%, ngelixa derivates uxande of format M10 ezifana 182mm x 183.75mm, 182mm x 185.3 mm, ezibizwa ngokuba micro-rectangular yi CPIA (usebenzisa olu lwimi uguqulelo ngomatshini. 20.3% inokuba 2028%, kodwa XNUMX% kwi-XNUMX.
Isabelo semarike se-210 mm yesikwele se-wafers kunye ne-rectangular wafers ngo-2023 yayiyi-20% kunye ne-10%, ngokulandelanayo. Eyokugqibela kusenokwenzeka ukuba ibhekisa kwiiwafers ezisikwe ngesiqingatha ezisetyenziswa ngoku kuphela kulungiso lwe-HJT. Ukuya phambili, ezi zinokuba ngubukhulu bexesha elizayo, kodwa ezi zisafuna ukuqinisekiswa okuqhubekayo yimarike.
Ngokubhekiselele kwitekhnoloji yeseli, uhlalutyo lwe-CPIA lubonisa ukuba uninzi lwemigca esanda kusekwa isekelwe kuhlobo lwe-n, ekulindeleke ukuba lukhule kwiminyaka ezayo, lutyhalela i-PERC kumhlalaphantsi. Nangona kunjalo, ngo-2023, i-PERC yayisalawula indawo yetekhnoloji yeseli ngokwesixa somthamo ofakiweyo ngesabelo sama-73%, ngelixa i-n-type isonwabela yonke i-pie.
Ngaphakathi kohlobo lwe-n, i-TOPCon ngokucacileyo yayinesabelo esikhulu se-26.5%, kunye ne-2.6% ye-HJT, ngelixa i-back contact architecture imelwe kufutshane ne-1%. Ngelixa oku kukukhula okubalulekileyo ngo-2022, uqikelelo luka-2025 lunethemba ngakumbi lohlobo lwe-n, ngakumbi i-TOPCon, ekulindeleke ukuba ilawule umjelo wetekhnoloji yeseli ngesabelo esingaphezulu kwama-50%. Obunye ubuchwephesha beeseli eziphucukileyo kulindeleke ukuba buphindeke kabini izabelo zabo ngo-2024 kwinqanaba lika-2023. I-PERC kuphela ngaphandle; njengoko kulindelwe, iteknoloji iya kulahlekelwa ubukhosi bayo kunye nobukho be-30%. Okubangela umdla kukuba, i-tandem cell architectures ayikhange ikhankanywe kwimephu yendlela ye-CPIA.
Kwi-2023, umyinge wemveliso yobuninzi ukusebenza kakuhle kweeseli zelanga yeeseli ze-PERC zifikelele kwi-23.4%, i-25% ye-TOPCon kunye ne-25.2% ye-HJT. Ngo-2025, i-CPIA iqikelela ukuba okufanayo kuya kwanda ukuya kuma-23.7%, 25.7% kunye nama-26.2%, ngokulandelanayo. Ayiboni nakuphi na ukuphumelela okuphambili okuya phambili ukusukela oko isikhokelo sayo sika-2028 kwezi teknoloji zeeseli bukhulu be-24%, 26.5% kunye ne-26.8%, ngokulandelelanayo. Ukuze i-HJT isebenze kakuhle, ifakela kwisiqingatha seeseli ze-182 mm kunye ne-210 mm iifomati, eziye zavela njengemo yobugcisa be-HJT.
Ixabiso elikhulu leeseli zelanga lixhomekeke ekusebenziseni intlama yesilivere. Okwangoku, ishishini lisebenzisa i-high-temperature yesilivere yokunamathisela kwi-p-type kunye neeseli ze-TOPCon, kunye ne-low-temperature yesilivere yeepasti zeeseli ze-HJT. Ngo-2023, isixa sesilivere esisetyenziswe kwicala langaphambili sasimalunga ne-59 mg / isiqwenga seeseli zohlobo lwe-p, kwaye ngasemva ukusetyenziswa kwesilivere kwakumalunga ne-25 mg / piece.
Iiseli ze-N-type ze-TOPCon zisebenzisa i-avareji malunga ne-109 mg / iqhekeza lesilivere kumacala omabini, ngelixa i-HJT i-HJT i-double-sided low-low-low-temperature yesilivere yokucola ukusetyenziswa yayimalunga ne-115 mg / piece.
phakathi abaguquli, abaguquli beentambo babalelwa kwi-80% yesabelo semarike kunyaka ophelileyo ngelixa i-inverters ephakathi ibango isabelo esiseleyo. Umbutho ubona kwangaphambili ukungaqiniseki okukhulu kwizabelo zentengiso zeentlobo ezahlukeneyo ze-inverters njengoko utshintsho lwenzeka kwiimeko zesicelo kunye neteknoloji iyaguquka.
I-CPIA ithi ishishini laseTshayina lePV liqeshe abantu abazizigidi ezi-3.53 ngo-2022, kuquka ne-589,000 kwingqesho ngqo. Ngo-2025, ishishini liya kuqesha izigidi ezi-4.875 ukuya kwi-5.808 yezigidi, kubandakanywa ama-813,000 ukuya kuma-968,000 kwimisebenzi ethe ngqo.
Yonke imephu yendlela ye-CPIA iyafumaneka kuyo website ngesiTshayina.
Umthombo ovela Iindaba zaseTaiyang
Ukuziphendulela: Ulwazi oluchazwe ngasentla lunikezelwa yiTaiyang News ngokuzimeleyo kwi-Cooig.com. I-Cooig.com ayenzi lumelo kunye neziqinisekiso malunga nomgangatho kunye nokuthembeka komthengisi kunye neemveliso.
