Infineon Technologies AG, a global semiconductor leader in power systems and IoT, will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi EV for its recently announced SU7 until 2027.
Infineon’s CoolSiC-based power modules allow for higher operating temperatures, resulting in improved performance, driving dynamics and lifetime. Traction inverters based on the technology can, for example, further increase electric vehicle range. The HybridPACK Drive is Infineon’s market-leading power module family for electric vehicles, with almost 8.5 million units sold since 2017.
Infineon provides two HybridPACK Drive G2 CoolSiC 1200 V modules for the Xiaomi SU7 Max. In addition, Infineon supplies Xiaomi EV with a broad range of products per car, including, for example, EiceDRIVER gate drivers and more than ten microcontrollers in various applications. The two companies also agreed to further cooperate on SiC automotive applications to utilize fully the benefits of Infineon’s SiC portfolio.
According to the latest data from TechInsights, Infineon is the largest semiconductor supplier to the automotive industry. In addition to its number one position in automotive power semiconductors, Infineon also took the lead in the field of automotive microcontrollers last year.
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